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Articles published by JEDEC

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JEDEC Prepares SPHBM4 Standard to Deliver HBM4-Level Throughput with Reduced Pin Count
From JEDEC
Via Business Wire
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JEDEC Announces Annual Update of DDR5 Serial Presence Detect (SPD) Contents Standard
From JEDEC
Via Business Wire
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JEDEC® Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards
From JEDEC
Via Business Wire
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JEDEC Announces Enhanced NAND Flash Interface Standard With Increased Speeds and Efficiency
From JEDEC
Via Business Wire
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JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
From JEDEC
Via Business Wire
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JEDEC to Launch New Raw Card DIMM Designs with DDR5 Clock Drivers, Enhancing Client Computing Memory Performance and Stability at 6400 Mbps and Beyond
From JEDEC
Via Business Wire
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JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
From JEDEC
Via Business Wire
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JEDEC Publishes Essential Test Method to Address Switching Energy Loss in Wide Bandgap and Silicon Semiconductor Power Devices
From JEDEC
Via Business Wire
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JEDEC Releases New Standard for LPDDR5/5X Serial Presence Detect (SPD) Contents
From JEDEC
Via Business Wire
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Discover the Future of Automotive Electronics: Join JEDEC’s Forum in San Jose on September 19th
From JEDEC
Via Business Wire
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JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards
From JEDEC
Via Business Wire
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JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration
From JEDEC
Via Business Wire
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JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen Technologies
From JEDEC
Via Business Wire
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JEDEC® Publishes GDDR7 Graphics Memory Standard
From JEDEC
Via Business Wire
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JEDEC Publishes New CAMM2 Memory Module Standard
From JEDEC
Via Business Wire
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JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation
From JEDEC
Via Business Wire
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JEDEC Board Presents 2023 Distinguished Executive Leadership Award to AMD CEO Dr. Lisa T. Su
From JEDEC
Via Business Wire
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JEDEC Publishes New Standard to Support CXLTM Memory Module Implementation
From JEDEC
Via Business Wire
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JEDEC Publishes Major Update to JEP30 PartModel Guidelines
From JEDEC
Via Business Wire
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JEDEC Expands CAMM Standardization to include Two Key Memory Technologies
From JEDEC
Via Business Wire
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JEDEC Creates New Automotive Steering Subcommittee
From JEDEC
Via Business Wire
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JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Series of Documents for Reliability and Testing of Silicon Carbide (SiC) MOSFETs
From JEDEC
Via Business Wire
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Open Compute Project Foundation and JEDEC Announce a New Collaboration
From JEDEC
Via Business Wire
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JEDEC Publishes Automotive Solid State Drive (SSD) Device Standard
From JEDEC
Via Business Wire
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JEDEC To Host In-Person Memory Forum and DDR5 Workshop
From JEDEC
Via Business Wire
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JEDEC Board Selects Samsung Memory Business President as Recipient of its 2022 Distinguished Executive Leadership Award
From JEDEC
Via Business Wire
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