Amkor Technology, Inc. (Nasdaq: AMKR) today announced the introduction of FusionQuad™, a novel package technology designed for applications that demand superior electrical and thermal performance in a budget-conscious environment. Amkor recently co-presented FusionQuad™ with a leading digital storage OEM at the Surface Mount Technology Association (SMTA) Pan Pacific Microelectronics Symposium in Kauai, HI. The paper highlighted FusionQuad’s size and performance benefits reporting a dramatic improvement in electrical performance at frequencies up to 10 GHz.
FusionQuad™ is a leadframe-based, plastic encapsulated package which integrates bottom lands within a standard QFP package outline. The novel combination of both peripheral leads and bottom lands allows for an approximate doubling of I/O within a given body size, or a nearly 50% reduction in body size for an existing lead count. Initial FusionQuad™ package options range from 100 to 376 I/O – in both single and dual row bottom land configurations – in body sizes ranging from 10 to 24mm. With a package thickness of just 0.8mm, FusionQuad™ is attractive for a variety of applications in practically all semiconductor markets.
“We are excited to bring to market a new packaging concept that meets the need for high performance and low cost,” said Jim Fusaro, corporate vice president responsible for wirebond products at Amkor. Fusaro added, “Just as our MicroLeadFrame® platform has enjoyed wide-spread adoption in the industry, we believe FusionQuad™ represents a similar breakthrough in performance, size and cost for higher lead count devices. We’ve had strong acceptance from our alpha customers during the qualification phase, leading to key design wins in the target applications.”
“With the combination of outstanding thermal capability and excellent RF electrical performance in a cost-effective package, we believe IC designers, system architects and packaging experts will find FusionQuad™ a compelling solution for a wide range of applications including computing, communications and consumer electronics,” said Tim Olson, senior vice president of SiP and leadframe products at Amkor.
“The unique footprint of FusionQuad™ allows for mounting on low cost printed circuit boards enabling cost-effective system solutions. Board level mounting and reliability studies have been successfully completed by Amkor, a leading EMS provider, and the OEM. Our goal is to establish FusionQuad™ as an industry standard with broad availability,” noted Olson.
FusionQuad™ is a trademark of Amkor Technology, Inc.
MicroLeadFrame® is a registered trademark of Amkor Technology, Inc.
About Amkor
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company’s SEC filings and technical information on FusionQuad™ can be found on Amkor’s web site: www.amkor.com.
Contacts:
Shellene Garner
Manager II, Marcom
480-821-5000
x. 5415
sgarn@amkor.com
