Ventiva®, a leader in thermal solutions, today announced it is showcasing two new laptop reference designs with Compal at CES 2026. These new designs, which are built around Ventiva’s ionic cooling-based thermal management solutions, are intended to help accelerate the development of laptops that can run advanced AI tasks directly on the device.

AI workloads are reshaping laptop system architecture, with large language models (LLMs), sustained high-power operation, and increasing on-device inference generating concentrated heat that conventional fan-based cooling struggles to manage. Through these collaborative reference designs, Ventiva is demonstrating how its solid-state all-electronic heat transfer technology cools electronic devices without mechanical fans, noise, or vibration – enabling local AI workloads in sleek, silent laptops.

• AI-Ready Laptop Reference Design
  
  
  
  The AI-Ready Laptop reference platform demonstrates how Ventiva’s Zoned Cooling™ design approach reclaims valuable motherboard space, simplifies system construction, reduces total cost of ownership, and delivers thinner, quieter systems without sacrificing performance.
  
  
  
  The laptop is powered by three 62mm Ventiva modules and supports a 28W CPU and 44.3W total platform power in a sub-16 mm chassis. The design accommodates up to a 55 Whr battery, full 2280 SSD support, and Microsoft Copilot+ readiness. The parallel Ventiva array and rear-edge venting reduce impedance, increase cooling efficiency, and create a scalable thermal pathway for future systems.
  
  
  
  With Ventiva’s Zoned Cooling design, all cooling vents are positioned at the rear of the device, enabling a cleaner internal layout. Bulky mechanical fans, fin stacks, and heat pipes are replaced with Ventiva’s thermal management subsystem. This approach can return up to 7,200 mm² of motherboard real estate, supporting additional memory, storage, larger batteries, or new components. It also reduces system costs through simplified construction and lower inventory requirements, while delivering a lower total cost of ownership with modular, scalable thermal components.
  
  
  
  “This architecture reflects a new system-level approach to performance and thermal design, where airflow, power, and compute are considered together rather than as separate constraints,” said Steve Huang, Vice President of R&D, Compal. “It enables higher sustained performance with increasingly compact form factors.”
  
  
  
  Ventiva’s ionic cooling technology is a foundational enabler of Zoned Cooling design and makes zone-based airflow control practical across consumer, enterprise, and data center deployments. More information is available in the white paper, Zoned Cooling: Unlocking a New Era of System Design Freedom.
  
  
  
  “High performance, compact form factors have been an on-going design target for laptops, and AI is accelerating those demands beyond what traditional cooling technologies can support. Our Zoned Cooling approach unlocks new design freedom while enabling sustained AI performance in thinner, quieter systems,” said Carl Schlachte, Chairman, President, and CEO, Ventiva. “Our new laptop reference design, which supports AI-optimized chipsets, is a blueprint for how the industry can rethink thermal management and design innovation for the AI era.”
  
  

• Premium Laptop Reference Design
  
  
  
  The new Premium Laptop reference platform introduces an advanced design that features an embedded sound bar within the laptop hinge. It leverages Ventiva’s thermal management subsystem to deliver hyper-targeted cooling directly to hotspots within the system, enabling silent operation and a slimmer system architecture.

Meet with Us

Ventiva’s laptop reference designs are available now for OEM and partner evaluation. Ventiva executives and technical leaders will be available on-site at CES 2026 for briefings and deep-dive discussions. To schedule a meeting, please contact Julie Seymour at julie.seymour@ventiva.com.

About Ionic Cooling Technology

Ventiva’s solid-state, all-electronic heat transfer technology leverages the principles of electrohydrodynamic (EHD) flow to move ionized air molecules within an electric field. This ionic cooling innovation moves air without mechanical fans, creating silent, vibration-free airflow. Unlike traditional cooling systems, Ventiva devices scale easily, integrate cleanly into system designs, and enable airflow configurations that were not previously possible.

Ventiva’s thermal management subsystem offers an intelligent cooling solution that is thin, lightweight, and highly modular. It continuously monitors its operation, delivering more or less airflow as an electronic system requires. Combining advanced monitoring and algorithms, the solution’s real-time software can be combined with overall system performance monitoring to provide a robust, system-level thermal solution.

About Ventiva

Ventiva, a leading company in active cooling solutions for electronic devices, enables thinner, faster, and cooler high-performance devices that are lightweight, silent, and vibration-free. The company’s patented ionic cooling technology is a pioneering all-electronic heat transfer technology created to address the thermal problems exacerbated by modern high-performance semiconductor design. Learn more at ventiva.com or follow us on LinkedIn.

© 2026, Ventiva, Inc. All rights reserved. VENTIVA, the VENTIVA LOGO, and ZONED COOLING are trademarks or registered trademarks of Ventiva, Inc., in the U.S. and other countries. All other trademarks are the property of their respective owners.

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Our new laptop reference design, which supports AI-optimized chipsets, is a blueprint for how the industry can rethink thermal management and design innovation for the AI era.