Ventiva®, a leader in thermal solutions, today introduced its new AI-Ready Laptop reference design, powered by the latest AMD Ryzen series mobile processor, at CES 2026.
AI workloads are reshaping laptop system architecture, with large language models (LLMs), sustained high-power operation, and increasing on-device inference generating concentrated heat that conventional fan-based cooling struggles to manage. Through this reference design, Ventiva is demonstrating how its Zoned Cooling™ design approach enables OEMs and ODMs to reclaim valuable motherboard space, simplify system construction, reduce total cost of ownership, and deliver thinner, quieter systems without sacrificing performance.
The new AI-Ready Laptop reference design, powered by three 62mm Ventiva modules, supports AMD’s latest AMD Ryzen processor and 44.3W total platform power in a sub-16mm chassis. The design accommodates up to a 77 Whr battery, full 2280 SSD support, and Microsoft Copilot+ readiness. The parallel Ventiva array and rear-edge venting reduce impedance, increase cooling efficiency, and create a scalable thermal pathway for future systems.
With Ventiva’s Zoned Cooling design, all cooling vents are positioned at the rear of the device, enabling a cleaner internal layout. Bulky mechanical fans, fin stacks, and heat pipes are replaced with Ventiva’s thermal management subsystem, opening a path to ultra-thin, optimized AI laptop designs.
This design approach returns up to 7,200 mm² of valuable motherboard real estate to system designers, supporting additional memory, storage, larger batteries, or new components. It also reduces system costs through simplified construction and lower inventory requirements, while delivering a lower total cost of ownership with modular, scalable thermal components. The result is thinner, quieter, high-performance laptop designs ideal for demanding AI workloads.
“AI is transforming what laptops need to deliver, and it’s clear that traditional cooling architectures can no longer keep pace. A Zoned Cooling approach unlocks new design freedom while enabling sustained AI performance in thinner, quieter systems,” said Carl Schlachte, Chairman, President, and CEO of Ventiva. "Our new laptop reference design, which supports AI-optimized chipsets including AMD’s latest Ryzen processor, is a blueprint for how the industry can rethink thermal management for the AI era.”
Ventiva’s ionic cooling technology is a foundational enabler of Zoned Cooling reference designs and makes zone-based airflow control practical across consumer, enterprise, and data center deployments. More information is available in the white paper, Zoned Cooling: Unlocking a New Era of System Design Freedom.
Meet with Us
Ventiva’s AMD-powered laptop reference design is available now for OEM and partner evaluation. Ventiva executives and technical leaders will be available on-site at CES 2026 for briefings and deep-dive discussions. To schedule a meeting, please contact Julie Seymour at julie.seymour@ventiva.com.
About Ionic Cooling Technology
Ventiva’s solid-state, all-electronic heat transfer technology leverages the principles of electrohydrodynamic (EHD) flow to move ionized air molecules within an electric field. This ionic cooling innovation moves air without mechanical fans, creating silent, vibration-free airflow. Unlike traditional cooling systems, Ventiva devices scale easily, integrate cleanly into system designs, and enable airflow configurations that were not previously possible.
Ventiva’s thermal management subsystem offers an intelligent cooling solution that is thin, lightweight, and highly modular. It continuously monitors its operation, delivering more or less airflow as an electronic system requires. Combining advanced monitoring and algorithms, the solution’s real-time software can be combined with overall system performance monitoring to provide a robust, system-level thermal solution.
About Ventiva
Ventiva, a leading company in active cooling solutions for electronic devices, enables thinner, faster, and cooler high-performance devices that are lightweight, silent, and vibration-free. The company’s patented ionic cooling technology is a pioneering all-electronic heat transfer technology created to address the thermal problems exacerbated by modern high-performance semiconductor design. Learn more at ventiva.com or follow us on LinkedIn.
© 2026, Ventiva, Inc. All rights reserved. VENTIVA, the VENTIVA LOGO, and ZONED COOLING are trademarks or registered trademarks of Ventiva, Inc., in the U.S. and other countries. All other trademarks are the property of their respective owners.
View source version on businesswire.com: https://www.businesswire.com/news/home/20260106524023/en/
Ventiva's Zoned Cooling approach unlocks new design freedom while enabling sustained AI performance in thinner, quieter systems
Contacts
Media Contact:
Julie Seymour
Ventiva
julie.seymour@ventiva.com